| 摘要 |
PROBLEM TO BE SOLVED: To provide a tape extension device capable of effectively and reliably dividing a wafer formed with lowered strength along a division planned line, along the division planned line. SOLUTION: The tape extension device extends a retaining tape which is mounted to an annular frame and to which the wafer having a plurality of areas zoned by a plurality of division planned lines is adhered. The tape extension device is comprised of a frame retaining means for retaining the annular frame, a plurality of tape pinching means for pinching an area between an inner periphery of the annular frame and the wafer, in the retaining tape mounted to the annular frame retained by the frame retaining means, and a tape extension means for moving the plurality of tape pinching means radially. COPYRIGHT: (C)2006,JPO&NCIPI |
