| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device exhibiting excellent reliability and manufacture stability. SOLUTION: The semiconductor device 100 comprises a semiconductor substrate 102, rewiring 110 provided on one surface of the semiconductor substrate 102, and a laminate type photosolder resist film 114 provided to cover at least a part of the rewiring 110 wherein the laminate type photosolder resist film 114 contains cardo type polymer. The cardo type polymer may be crosslinking polymer having a carboxylic acid group and an acrylate group in the same molecular chain. COPYRIGHT: (C)2006,JPO&NCIPI |
