发明名称 CUTTING METHOD AND DEVICE FOR ADHESIVE FILM
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a device to cut an adhesive film in good workmanship without causing a cover film to make dislocation on an adhesive substance layer or exfoliation when the adhesive film is deformed through the action of a shearing force generated at the time of cutting. <P>SOLUTION: The cutting device 1 is to cut the adhesive film 2 being transported into strips and is equipped with a cutter mechanism 10 and a heating mechanism (heating means) 3 and so on. The cutter mechanism 10 is composed of an upper blade unit 11A in which a plurality of upper blades 11 are arranged in row in the axial direction and a lower blade unit 12A in which a plurality of lower blades 12 are arranged in row in the axial direction. The heating mechanism 3 is arranged upstream of the cutter mechanism 10 and is composed of a blower 31, a heater 32, a temperature sensor 33, a temperature control part 34, etc. The blower 31 is connected with the heater 32 through a duct 35 etc. and arranged to blow a hot wind directly to the adhesive film 2. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2005288641(A) 申请公布日期 2005.10.20
申请号 JP20040108793 申请日期 2004.04.01
申请人 SONY CHEM CORP 发明人 KAWAI TOMONAGA
分类号 B26D1/24;B26D7/10;(IPC1-7):B26D7/10 主分类号 B26D1/24
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