发明名称 Method of manufacturing semiconductor device, acid etching resistance material and copolymer
摘要 Disclosed is an acid etching resistance material comprising a compound having a repeating unit represented by the following general formula (1): (in the general formula (1), R<SUP>1 </SUP>is a hydrogen atom or methyl group; R<SUP>3 </SUP>is a cyclic group selected from an alicyclic group and an aromatic group; R<SUP>4 </SUP>is a polar group; R<SUP>2 </SUP>is a group represented by the following general formula (2); and j is 0 or 1): (in the general formula (2), R<SUP>5 </SUP>is a hydrogen atom or methyl group).
申请公布号 US2005233483(A1) 申请公布日期 2005.10.20
申请号 US20050056094 申请日期 2005.02.14
申请人 ASAKAWA KOJI;OHASHI KENICHI;FUJIMOTO AKIRA;SASAKI TAKASHI 发明人 ASAKAWA KOJI;OHASHI KENICHI;FUJIMOTO AKIRA;SASAKI TAKASHI
分类号 C08F220/28;H01L21/00;H01L21/306;H01L21/308;H01L21/78;H01L33/22;(IPC1-7):H01L21/00 主分类号 C08F220/28
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