Cleaning solution and method of cleaning semiconductor devices using the same

摘要

A cleaning solution for preventing the collapse of photoresist patterns and a method of cleaning a semiconductor device using the cleaning solution; the cleaning solution includes a solvent and a surfactant and has a dynamic surface tension of about 50 dyne/cm or less at about 6 bubbles/seconds when measured by a maximum bubble pressure method. The collapse of the photoresist pattern can be prevented using the cleaning solution when forming minute photoresist patterns having about 100 nm or less pattern width. The cleaning solution containing a surfactant in a high concentration also can be prepared to reduce distribution expenses.