| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method to work with a double-side polishing device used in polishing etc., for example, of a semiconductor wafer, capable of sensing whether a work and a carrier to be carried to outside a platen has been carried out certainly. <P>SOLUTION: The polishing device is configured so that the work inserted to and held by the carrier is interposed between an upper 1 and a lower rotary platen 2 whereto polishing pads 3 are affixed and the obverse and reverse surfaces of the work are polished simultaneously while slurry is supplied onto the pads 3, wherein a foreign matter sensing method to work with this polishing device is to put the rotary platens 1 and 2 in tight attachment after the work and carrier having finished polishing are carried out from upon the platens. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
