发明名称 METHOD AND DEVICE FOR FORMING WIRING
摘要 <P>PROBLEM TO BE SOLVED: To provide a method and a device for forming wiring by which the productive efficiency can be improved greatly by forming wiring even when the positional deviation of an electronic component occurs. <P>SOLUTION: A first electronic component having a first electrode and a second electronic component having a second electrode are arranged on the X-Y axis plane of a coordinate system containing X and Y axes in a state where the relative position of the first and second electrodes is fixed. Then the data of a first point 254 indicating the position of the first electrode (electrode shape 252) and the data of a second point 264 indicating the position of the second electrode (electrode shape 252) in the X-Y axis plane are acquired. In addition, the data of a line image connecting the first and second points 254 and 264 to each other are acquired as the data 78 of a bit map prepared by dividing the X-Y axis plane into a plurality of pixels by using the data of the first and second points 254 and 264. Thereafter, the wiring connecting the first and second electrodes to each other is formed by discharging a dispersed liquid containing fine conductive particles in accordance with the data 78 of the bit map. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005294619(A) 申请公布日期 2005.10.20
申请号 JP20040108885 申请日期 2004.04.01
申请人 SEIKO EPSON CORP 发明人 KUROSAWA HIROFUMI
分类号 H01L21/60 主分类号 H01L21/60
代理机构 代理人
主权项
地址