| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having high resolution, high adhesion and a good cohesive property in development, and to provide a method for manufacturing a photosensitive resin laminate using the same and a substrate. <P>SOLUTION: The photosensitive resin composition contains (a) 30-70 mass% of a polymer having a carboxylic acid, an acid equivalent of 100-600 and a weight average molecular weight of 20,000-500,000, (b) 20-70 mass% of a photopolymerizable monomer having at least one ethylenically unsaturated bond and (c) 0.1-20 mass% of a photopolymerization initiator, wherein a photopolymerization initiator having at least one structure selected from the group consisting of specified formulae (I)-(III) is contained as the photopolymerization initiator (c). <P>COPYRIGHT: (C)2006,JPO&NCIPI |
