发明名称 |
ELECTRONIC CIRCUIT DEVICE WITH SILICON SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide an electronic circuit having a silicon substrate wherein a compact, high-performance passive element or sensor is incorporated. SOLUTION: The electronic circuit device is comprised of a silicon substrate that includes a semiconductor device and wherein a recessed part is formed and at least one passive element that is formed by another process different from a silicon planer process for forming the semiconductor device. It is provided with a silicon substrate that electrically connects the semiconductor device, wherein the passive element is embedded in the recessed part of the silicon substrate and that is formed in the silicon substrate with the passive element. COPYRIGHT: (C)2006,JPO&NCIPI |
申请公布号 |
JP2005294419(A) |
申请公布日期 |
2005.10.20 |
申请号 |
JP20040105220 |
申请日期 |
2004.03.31 |
申请人 |
SEIKO INSTRUMENTS INC;ISHIDA MAKOTO |
发明人 |
ISHIDA MAKOTO;SAWADA KAZUAKI;TAKAO HIDEKUNI;SUDO MINORU |
分类号 |
H01L25/00;B81B7/00;G01P15/00;H01L21/335;H01L23/29;H01L23/52;H01L25/04;H01L25/065;H01L25/07;H01L25/16;H01L25/18;H01L29/06;H01L29/84;(IPC1-7):H01L25/00 |
主分类号 |
H01L25/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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