| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique by which the reliability of a package can be improved by suppressing the rise of a sealing cost by impressing the final sealing pressure upon a cavity from an injecting section having narrower area than a sliding member has by injecting a sealing resin into part of the cavity in a state where the sliding member is separated from the surface of the cavity. SOLUTION: Since the final pressure for sealing a semiconductor chip 126 is applied by means of a plunger 108 having a narrower area than a cavity block 106 or upper and lower sealing molds have, the power required at the time of applying the same pressure to the cavity 105 can be reduced by the Pascal's law. Therefore, it is not required to provide an excessive pressure impressing device to the cavity and, in addition, the energy cost at the time of impressing the pressure can be reduced. Consequently, the rise of the cost can be suppressed at the time of manufacturing a semiconductor package by sealing the semiconductor chip 126 in the package. COPYRIGHT: (C)2006,JPO&NCIPI |
