| 摘要 |
PROBLEM TO BE SOLVED: To realize wire bonding which can be applied to constitution in which semiconductor chips are mounted on top and reverse surfaces of a mounted plate and is highly reliable. SOLUTION: A recessed part 1221 is formed which stores a 1st semiconductor chip 41 and a 1st wire while a 1st wire 51 is not in contact with a heat plate when a lead frame 50 is mounted on the heat plate 122 fitted onto a heat block 121, so that a 1st main surface 501 of the lead frame is opposed to the heat plate. Further, a pipe 13 linking the recessed part to outside the heat plate 122 is formed in the heat plate 122 and gas which is supplied from outside through this pipe is heated by a heater 14 and discharged from the recessed part 1221. COPYRIGHT: (C)2006,JPO&NCIPI
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