| 摘要 |
PROBLEM TO BE SOLVED: To provide a process for manufacturing an electronic component capable of realizing ultrathin dielectric layer in an electronic component such as a multilayer ceramic capacitor while reducing short circuit failure rate, and to provide an electronic component being obtained by that manufacturing process. SOLUTION: In the process for manufacturing an electronic component having at least one pair of internal electrode layers 14 and 16 and a dielectric layer 10 being formed between the internal electrode layers, electrode films 12a and 14a containing a conductive composition and a dielectric composition and being sintered to form the internal electrode layers are formed, the electrode films 12a and 14a are laid in layers through a buffer layer 40 composed of a material not containing the main dielectric component of the dielectric composition taken into the dielectric layer formed after sintering and remaining therein, the electrode films 12a and 14a laid in layers through the buffer layer 40 are sintered, and the dielectric composition contained in the electrode films 12a and 14a is diffused between the electrode films 12a and 14a to form the dielectric layer 10 between the electrode films 12a and 14a. COPYRIGHT: (C)2006,JPO&NCIPI
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