| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal mold for sealing semiconductor device with resin that can surely suppress the occurrence of troubles when transfer molding is performed for sealing a semiconductor device with a resin. SOLUTION: The metal mold for sealing semiconductor device with resin is provided with a pair of molds and cavities 3 which provide spaces for placing a semiconductor element and performing transfer molding and runners 7 which supply the resin into the cavities 3 in the molds. The metal mold contains clamping areas 9 which directly clamp carriers 23 in the portions facing the molds along the cavities 3, and deformation imparting sections composed of projecting sections 11 respectively formed in the clamping areas 9 of the molds along the ends of the cavities 3, when the carriers 23 are clamped in the clamping areas 9 and recessed sections corresponding to the projecting sections 11. COPYRIGHT: (C)2006,JPO&NCIPI
|
