| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor encapsulation, which has the characteristics that the reliability concerning moisture is good and moisture condensation is less liable to occur and which can suitably be used for the use of CCD. SOLUTION: The epoxy resin composition for semiconductor encapsulation is an epoxy resin composition containing as the main components (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, and (D) an inorganic filler, and it is characterized by containing a hygroscopic alumina as the above inorganic filler. Preferably the specific surface area of the hygroscopic alumina is≥100 m<SP>2</SP>/g. COPYRIGHT: (C)2006,JPO&NCIPI
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