| 发明名称 |
Thermosetting resin composition and prepreg and laminated sheet using the same |
| 摘要 |
The present invention relates to a thermosetting resin composition comprising: (1) a metal salt of a disubstituted phosphinic acid, and (2) a resin having a dielectric constant of 2.9 or less at a frequency of 1 GHz or more, and a prepreg and a laminated board using the same.
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| 申请公布号 |
US2005234173(A1) |
申请公布日期 |
2005.10.20 |
| 申请号 |
US20040511102 |
申请日期 |
2004.10.14 |
| 申请人 |
HITACHI CHEMICAL CO., LTD. |
发明人 |
TSUCHIKAWA SHINJI;ARATA MICHITOSHI;TOMIOKA KENICHI;KOBAYASHI KAZUHITO |
| 分类号 |
C08J5/24;C08K5/5313;H05K1/03;(IPC1-7):C08L1/00 |
主分类号 |
C08J5/24 |
| 代理机构 |
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| 主权项 |
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| 地址 |
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