| 摘要 |
An LED chip mounting structure provided by the present invention includes a wiring board with a mounting pad ( 45 R), an LED chip ( 10 ) with an electrode ( 12 ) facing the mounting pad ( 45 R), a bump ( 47 ) disposed between the mounting pad ( 45 R) and the electrode ( 10 ) to electrically connect the mounting pad ( 45 R) to the electrode ( 10 ), and an adhesive member ( 7 ) for fixing the LED chip ( 10 ) to the wiring board ( 41 ).
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