Conductive adhesive and circuit using the same

摘要

The present invention provides a conductive adhesive comprising conductive particles and a resin wherein 30% by weight or more of the conductive particles substantially comprise silver and tin, and a molar ratio of silver and tin in the metal components of the conductive adhesive is in the range of 77.5:22.5 to 0:100; and a circuit connected by using the conductive adhesive.