Selfaligned optical element and optical wave-guide by means of solder bumps on rectangular pads

摘要

An optical module has an optical wave-guide structure (12) formed on a silicon substrate (11) and a laser diode array (13) solder bonded to first pads (11a-11j) patterned on the silicon substrate in a self-aligned manner by virtue of surface tension of solder during a reflow stage, and the first pads (11a-11j) are shaped into a rectangular parallelopiped configuration so as to make a ratio of a solder bump height to a pad width large without decrease of the volume of the solder bump, thereby generating large surface tension.