Apparatus for mounting of semi-conductor chips and method for stripping of a semi-conductor chip from a film

摘要

Vacuum is applied to a groove (12) in the support area of a chip ejector (6). A wafer table is moved vertically relative to a stripping edge (18) of a ramp (16) in the ejector, so as to pull the foil over the stripping edge, during which the chip detaches from the foil and falls on foil portion over the support area. The chip is then picked out. An independent claim is also included for semiconductor chip mounting apparatus.