| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin film electronic part and a board capable of preventing the solder dispersion by a thin solder dispersion prevention layer. SOLUTION: The thin film electronic part is provided with a support board 1, a thin film element A provided on the support board 1 and having an insulating layer 3 and electrode layers 5, 7, and outside terminals 11a, 11b comprising solder connected to the electrode layers 5, 7 through the solder dispersion prevention layer 21, which laminates two or more same material layers 21a, 21b. |
