| 摘要 |
PROBLEM TO BE SOLVED: To efficiently remove a resin 20 attached to a gate entrance 19 of an intermediate mold 3 when a board 5 mounting electronic parts 4 is molded by resin sealing by use of a three-sheet metal mold composed of a fixed cope 1, a movable drag 2 and the intermediate mold 3 (cavity plate). SOLUTION: First, a fused resin is injected from a resin injecting gate 8 in a cavity bottom 10 into a resin molding cavity 7 formed in the intermediate mold 3, and next the resin 20 attached to the gate entrance 19 is projected from the cavity side to be removed by a gate punch mechanism 22 for projecting along a center line 21 in the injection direction of the fused resin in the gate 8. COPYRIGHT: (C)2004,JPO |
