| 摘要 |
A semiconductor device is provided including a substrate having a wiring pattern including a plurality of lands and a semiconductor chip having a plurality of electrodes that are mounted on the substrate so that the electrodes may be placed opposite to the lands. The plurality of lands are aligned so that they may be divided into a plurality of first groups that are placed along a plurality of first parallel lines, and form a contour spreading in a direction along the first line. The plurality of electrodes are aligned so that they may be divided into a plurality of second groups that are placed along a plurality of second parallel lines, and may form a contour spreading in a direction crossing the second line. The lands and the electrodes are electrically connected to each other by being overlapped lengthwise. |
