| 摘要 |
A small soldering apparatus capable of increasing the reliability of products by reducing the occurrence of dross and using lead-free solder, wherein a primary jet nozzle (1), a secondary jet nozzle (2), and an unshown pump forming jet waves (24, 25) are installed in a solder tank (6) storing molten solder (S), solder flow guide plates (4, 5) are installed between the jet nozzles (1) and (2) at positions above the solder face (F) of the molten solder (S) through which the molten solder drops on the solder surface, the solder flow guide plates (4, 5) are formed in a V-shape by making cross each other solder guide parts for dropping the molten solder (S) on the solder face (F) in the solder tank (6) at different positions, and the molten solder (K) dropped on the upper part of the solder flow guide plates (4, 5) passes through the solder guide parts and drops on the different sides of the nozzles from the sides on which the molten solder was jetted.
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