发明名称 |
High temperature stable thermal interface material |
摘要 |
A thermally-conductive interface interposable intermediate a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween. The interface includes a thermally-conductive compound formed into a layer which is conformable between the first and second heat transfer surface. The compound is an admixture of: (a) a liquid resin constituent; and (b) a particulate filler constituent. The liquid resin constituent may be an ethylene-propylene copolymer (EPM) or a terpolymer (EPDM) of ethylene and propylene and a diene which may be ethylidene norbornene (ENB) or dicyclopentadiene (DCPD).
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申请公布号 |
US6956739(B2) |
申请公布日期 |
2005.10.18 |
申请号 |
US20030431392 |
申请日期 |
2003.05.07 |
申请人 |
PARKER-HANNIFIN CORPORATION |
发明人 |
BUNYAN MICHAEL H. |
分类号 |
H01L23/427;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/427 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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