| 发明名称 |
Method for joining a silicon plate to a second plate |
| 摘要 |
A method for joining a silicon plate to a second plate, a laser beam being directed through the silicon plate at the second plate. In the process, the wavelength of the laser beam is selected in such a way that only a negligibly small amount of energy is absorbed in the silicon plate. A strongly absorbent material is hotmelted by the laser beam's energy and then produces a bond between the silicon plate and the second plate. |
| 申请公布号 |
US6955975(B2) |
申请公布日期 |
2005.10.18 |
| 申请号 |
US20030433525 |
申请日期 |
2003.11.13 |
| 申请人 |
ROBERT BOSCH GMBH |
发明人 |
REICHENBACH FRANK;FISCHER FRANK;HAUSNER RALF;HAAG FRIEDER;GRAF ECKHARD;LUTZ MARKUS |
| 分类号 |
B29C65/16;B29C65/60;B81C1/00;H01L21/20;H01L21/58;H01L21/60;H01L21/762;(IPC1-7):H01L21/30;H01L21/46 |
主分类号 |
B29C65/16 |
| 代理机构 |
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代理人 |
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| 主权项 |
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