Comparison of chemical-mechanical polishing processes

摘要

Chemical-mechanical polishing ("CMP") processes performed on bodies ( 10 ), each having areas ( 16 and 18 ) of different depression pattern densities, are compared by correlating polishing data accumulated, for one such body, on an area ( 16 ) of one pattern density to polishing data accumulated, for that body, on an area of another pattern density for each of the CMP processes.