Encapsulation method for electronic component on substrate, comprises injecting filler and encapsulating material into mould on opposite sides of support film

摘要

A filler material (8b) is injected into the mould on the opposite side of a support film (12) to the substrate (14) at essentially the same pressure as the encapsulating material (8a). At least one support film is placed inside a mould comprising at least two mould sections (2, 4), the substrate with the electronic component (16) on top is placed on top of the film so that at least one side of the substrate is masked from the encapsulating material by the film and the mould is closed so that the mould sections are at least partially supported by the film. The encapsulating material is injected into the mould under pressure from the side of the mould cavity facing the substrate.