| 发明名称 |
EMI grounding pins for CPU/ASIC chips |
| 摘要 |
An integrated circuit package includes EMI containment features. The EMI containment features may include a plurality of pins on a substrate of the integrated circuit package. The pins may be a peripheral row of pins in an array of pins. The pins may couple a lid of the package to at least one ground plane of a circuit board.
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| 申请公布号 |
US6956285(B2) |
申请公布日期 |
2005.10.18 |
| 申请号 |
US20030345015 |
申请日期 |
2003.01.15 |
| 申请人 |
SUN MICROSYSTEMS, INC. |
发明人 |
RADU SERGIU;SEN BIDYUT K.;HOCKANSON DAVID;WILL JOHN E. |
| 分类号 |
H01L23/552;(IPC1-7):H01L23/48;H01L23/12;H01L23/06;H01L23/52 |
主分类号 |
H01L23/552 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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