发明名称 SILICON COMPOUND CONTAINING EPOXY GROUP AND THERMOSETTING RESIN COMPOSITION
摘要 A silicon compound containing an epoxy group which is obtainable by subjecting at least one alkoxy silicon compound containing an epoxy group represented by a general formula (1a): R1aSi(OR2)3, wherein R1arepresents a substituent having an epoxy group and R2 represents an alkyl group having four or less carbon atoms, by itself, or said compound and at least one substituted alkoxy silicon compound represented by a general formula (1b): R1bSi(OR3) 3, wherein R1b represents an alkyl group having ten or less carbon atoms, an aryl group or an unsaturated aliphatic residue, and R 3 represents an alkyl group having four or less carbon atoms, to a condensation reaction in the presence of a basic catalyst.
申请公布号 KR20050099978(A) 申请公布日期 2005.10.17
申请号 KR20057013772 申请日期 2005.07.26
申请人 NIPPON KAYAKU KABUSHIKI KAISHA 发明人 NAKAYAMA KOJI
分类号 C08G77/14;C08L63/00;C08L83/06;(IPC1-7):C08G77/14;C08G59/02 主分类号 C08G77/14
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