| 摘要 |
PROBLEM TO BE SOLVED: To provide a method by which a circuit board that has a wide tolerance of alignment accuracy, coping with landless holes or holes having narrow land widths required for increasing the density of the circuit board. SOLUTION: The method of manufacturing the circuit board is composed of a step of forming a photo-crosslinking resin layer on the surface of an insulating substrate, having a conductive layer on its surface and on the internal walls of a through hole or/and a non-through hole, a step of forming a second resin layer on the photo-crosslinkable resin layer formed on the surface conductive layer, and a step of removing the photo-crosslinking layer formed on the holes. The method is also composed of a step of providing a fourth resin layer on the conductive layer formed in the holes, a step of crosslinking the photo-crosslinkable resin at the portion corresponding to a circuit, and a step of removing the second resin layer. In addition, the method is also composed of a step of removing the unreacted photo-crosslinking resin layer corresponding to a non-circuit section, a step of etching the exposed conductive layer, and a step of removing the fourth resin layer and photo-crosslinkable resin layer. COPYRIGHT: (C)2006,JPO&NCIPI
|
