Land grid array socket having improved terminals

摘要

A land grid array socket ( 1 ) in accordance with the present invention is provided. The socket comprises an insulative housing ( 2 ) having a plurality of passageways ( 24 ) extending throughout an upper mating surface ( 22 ) and a lower mounting surface ( 20 ). A plurality of electrical terminals ( 3 ) are received in corresponding passageways, each terminal comprises a first part ( 32 ) having a first spring arm ( 322 ) extending out of the upper mating surface for electrically connected to an IC chip ( 4 ) and a second spring arm ( 306 ) extending out of the lower mounting surface for electrically connected to a motherboard ( 5 ). The first part and the second part are accommodated in a same passageway and separate from each other while interconnected by a third spring arm ( 304 ) settled therebetween.