发明名称 Wireless substrate-like sensor
摘要 In accordance with an aspect of the present invention, a wireless substrate-like sensor is configured to be low-profile. One exemplary low-profile design includes using an image acquisition system on a leadless ceramic carrier chip. Then a circuit board, or rigid interconnect, is provided with a recess to accommodate the image acquisition system. The image acquisition system is disposed within the recess and coupled to the board through the periphery of the leadless ceramic carrier chip.
申请公布号 US2005224902(A1) 申请公布日期 2005.10.13
申请号 US20050075363 申请日期 2005.03.08
申请人 RAMSEY CRAIG C;GARDNER DELRAE H;LASSAHN JEFFREY K 发明人 RAMSEY CRAIG C.;GARDNER DELRAE H.;LASSAHN JEFFREY K.
分类号 H01L21/00;H01L21/338;H01L27/14;H01L29/82;H01L29/84;H04M1/00;H05K1/18;(IPC1-7):H01L21/338 主分类号 H01L21/00
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