发明名称 |
Wireless substrate-like sensor |
摘要 |
In accordance with an aspect of the present invention, a wireless substrate-like sensor is configured to be low-profile. One exemplary low-profile design includes using an image acquisition system on a leadless ceramic carrier chip. Then a circuit board, or rigid interconnect, is provided with a recess to accommodate the image acquisition system. The image acquisition system is disposed within the recess and coupled to the board through the periphery of the leadless ceramic carrier chip.
|
申请公布号 |
US2005224902(A1) |
申请公布日期 |
2005.10.13 |
申请号 |
US20050075363 |
申请日期 |
2005.03.08 |
申请人 |
RAMSEY CRAIG C;GARDNER DELRAE H;LASSAHN JEFFREY K |
发明人 |
RAMSEY CRAIG C.;GARDNER DELRAE H.;LASSAHN JEFFREY K. |
分类号 |
H01L21/00;H01L21/338;H01L27/14;H01L29/82;H01L29/84;H04M1/00;H05K1/18;(IPC1-7):H01L21/338 |
主分类号 |
H01L21/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|