| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an alkali-developable photosensitive thermosetting resin composition, capable of forming fine patterns, ensuring satisfactory flexibility of cured films, and capable of forming films superior in solder dip resistance, chemical resistance, etc., and to provide a flexible printed wiring board which uses the composition. <P>SOLUTION: The alkali-developable photosensitive thermosetting resin composition comprises (A) a resin component, having a (meth)acryloyl group and a carboxyl group in one molecule and soluble in a dilute alkali solution, (B) a thermosetting component, (C) a photopolymerization initiator, (D) a phosphazene compound and (E) a diluent, bears comparison with a photosensitive thermosetting resin composition, using a halogen-based flame retardant with respect to the characteristics, and has superior properties such that hydrogen bromide which has thus been considered a problem so far in combustion is not generated. The flexible printed wiring board using the composition is also provided. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
