发明名称 |
Atomic layer deposited nanolaminates of HfO2/ZrO2 films as gate dielectrics |
摘要 |
A dielectric film containing HfO<SUB>2</SUB>/ZrO<SUB>2 </SUB>nanolaminates and a method of fabricating such a dielectric film produce a reliable gate dielectric having an equivalent oxide thickness thinner than attainable using SiO<SUB>2</SUB>. A gate dielectric is formed by atomic layer deposition of HfO<SUB>2 </SUB>using a HfI<SUB>4 </SUB>precursor followed by the formation of ZrO<SUB>2 </SUB>on the HfO<SUB>2 </SUB>layer.
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申请公布号 |
US2005227442(A1) |
申请公布日期 |
2005.10.13 |
申请号 |
US20050148505 |
申请日期 |
2005.06.09 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
AHN KIE Y.;FORBES LEONARD |
分类号 |
C23C16/40;C23C16/44;C23C16/455;H01L21/28;H01L21/316;H01L29/51;(IPC1-7):H01L21/336 |
主分类号 |
C23C16/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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