发明名称 |
Verbundstoff mit Metallschicht für eine Leiterplatte |
摘要 |
A method of producing a metal laminate for a circuit board includes a first step of press-bonding a thermotropic liquid crystal polymer film 1 having a segment orientation ratio SOR within a range not smaller than 0.90 and smaller than 1.15 along the longitudinal direction of the film, to a metal sheet 3 between hot rolls while the thermotropic liquid crystal polymer film 1 is in a tense or non-tense state; and a second step of heating the laminate obtained in the first step to a temperature not lower than the melting point of the thermotropic liquid crystal polymer film. <IMAGE> |
申请公布号 |
DE60020446(T2) |
申请公布日期 |
2005.10.13 |
申请号 |
DE2000620446T |
申请日期 |
2000.03.27 |
申请人 |
KURARAY CO., LTD |
发明人 |
ONODERA, MINORU;YOSHIKAWA, TADAO;TSUDAKA, TAKEICHI;SATO, TOSHIAKI |
分类号 |
H05K1/03;B29C65/02;B32B15/08;B32B15/09;B32B27/36;B32B37/10;B32B37/20;H05K3/00;H05K3/02;H05K3/46;(IPC1-7):B32B15/08;B32B31/00;B32B31/20 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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