| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermoplastic resin molded article by using a polyamide/polyphenylene ether alloy whose residence stability at molding and its thermal stability of the molded article, especially its coating adhesiveness after heat exposure are remarkably improved. SOLUTION: The polyamide/polyphenylene ether resin composition comprises a polyamide, a polyphenylene ether, a phosphorus compound and a soluble metal aluminate represented by the general formula: (M<SB>2</SB>O)<SB>X</SB>(Al<SB>2</SB>O<SB>3</SB>)<SB>Y</SB>, wherein X+Y=1 and M is a group 1 metallic element of the periodic table. COPYRIGHT: (C)2006,JPO&NCIPI
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