| 摘要 |
PROBLEM TO BE SOLVED: To provide a heating device, having a heater which has high rigidity and low heat capacity, has no possibility of warpage and has sufficiently low electrical resistance for a metal layer. SOLUTION: In the heating arrangement, a conductor playing a role as the metal layer is arranged on a loading face of the object to be heated, in the ceramic heater where a heating element is formed on a surface or inside for loading the object to be heated, such as a semiconductor wafer and a semiconductor and heating it. The conductor is not chemically coupled with the ceramic heater. Thus, the heating arrangement can be installed in which the metal layer has thickness that becomes electrically sufficient low resistance, which has high rigidity and low heat capacity and in which curvature will not occur. COPYRIGHT: (C)2006,JPO&NCIPI |
