| 摘要 |
PROBLEM TO BE SOLVED: To realize miniaturization and high integration of a power module to which high reliability is required. SOLUTION: In this ceramics two layer circuit board, a metallic circuit pattern is formed on the circuit surface side of a ceramic circuit board through an insulator. The ceramic board is an aluminum nitride board or a silicon nitride board. The insulator contains at least one kind inorganic substance selected from aluminum oxide, boron nitride, diamond, beryllium oxide, and aluminum nitride, and containing resin selected from epoxide resin, silicone resin, BT resin and polyimide resin. Modulus of void of the insulator is at most 20%. The thickness of the metallic circuit pattern is 0.05-0.3 mm. A distance between the surface of the metallic circuit pattern and the surface of the insulator end is at least 0.5 mm. COPYRIGHT: (C)2006,JPO&NCIPI |
