发明名称 BARREL PLATING EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide barrel plating equipment which applies a uniform plating treatment to the whole of works by contriving the structure of comb-type electrodes. SOLUTION: Since electrodes 21 are not arranged but nonconductive stirring members 23 are arranged on the part near the inside face of each edge part 12 where the circulation of a plating liquid PL is inferior compared with the other part in the internal space of a barrel 10, the stirring member 23 is positively operated in such a manner that works W present at the part near the inside face of each edge part 12 in the barrel 10 is drawn inward from the inside face of the edge part 12, thus the occurrence of defects in plating such as insufficiency in film thickness on the works W present at the above parts is suppressed. As a result, uniform plating can be applied to the whole of the work W. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005281820(A) 申请公布日期 2005.10.13
申请号 JP20040100169 申请日期 2004.03.30
申请人 TAIYO KAGAKU KOGYO KK 发明人 YOSHIKAWA TAKEFUMI;ISHIHARA SHOJI;ORIGASA MAKOTO
分类号 C25D17/20;(IPC1-7):C25D17/20 主分类号 C25D17/20
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