| 摘要 |
PROBLEM TO BE SOLVED: To provide magnetic film plating equipment with which the problems relating to the arrangement of the elements constituting the plating equipment can be reduced. SOLUTION: The plating equipment has a position regulation mechanism capable of optionally changing at least either of a direction of an impressed magnetic field 3 or a direction of a substrate 1 to be deposited with a magnetic film according to the shape of at least either of a magnetic film forming pattern shape 2 or a magnetic domain shape. COPYRIGHT: (C)2006,JPO&NCIPI
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