发明名称 MOISTURE CURABLE RESIN COMPOSITION AND ITS CURING ACCELERATION METHOD
摘要 PROBLEM TO BE SOLVED: To solve the problems that, since a moisture curable adhesive, sealing material, etc. cause the curing to proceed by internal moisture or suction of moisture of an adherend, external moisture, etc., if the adherend is a material non-porous and not containing moisture such as a metal and a tile, the curing time becomes long, and, if the coating thickness is thick, the deep part is not cured, and so forth. SOLUTION: The moisture curable composition incorporates a modified silicone polymer having an alkoxysilyl group in the terminal, a curing catalyst and Zeolite, and can advance the curing rapidly by making the water adsorbed in Zeolite be discharged into the outside by heating. Because this enables the rapid curing even if the adherend is of non-porous nature not containing moisture or the coating thickness is thick, the works of adhesion, sealing, etc. can be done promptly. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005281404(A) 申请公布日期 2005.10.13
申请号 JP20040095049 申请日期 2004.03.29
申请人 AICA KOGYO CO LTD 发明人 YAMADA SHINICHI;YANAGI TAKU
分类号 C08L101/10;C08K3/34;C09J183/04;(IPC1-7):C08L101/10 主分类号 C08L101/10
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