| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermal head which prevents generation of bubbles at a sealing part and at the same time, can suppress deflection of a substrate due to thermal expansion, and to provide its manufacturing method. SOLUTION: In the thermal head, a head substrate with a plurality of heating resistors which heat by energization, common electrodes connected in common to one end part of the plurality of heating resistors, and a plurality of discrete electrodes each connected to the other end part of each heating resistor; and a printed circuit board equipped with a plurality of driving elements for carrying out energization control to the plurality of heating resistors of the head substrate are bonded and fixed in contact with each other on a heat sink. The plurality of discrete electrodes and the plurality of driving elements are wire bonded beyond a gap generated at a contact face between the head substrate and the printed circuit board. The wire bonding part is sealed by a resin material. An open space to communicate with the outside is formed at a bonding face between the printed circuit board and the heat sink. Moreover, an adhesive layer is partially interposed in a mode to make the open space communicate with the gap generated at the contact face between the head substrate and the printed circuit board. COPYRIGHT: (C)2006,JPO&NCIPI
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