发明名称 Methods of eliminating pattern collapse on photoresist patterns
摘要 A stabilizing solution for treating photoresist patterns and methods of preventing profile abnormalities, toppling and resist footing are disclosed. The stabilizing solution comprises a non-volatile component, such as non-volatile particles or polymers, which is applied after the photoresist material has been developed. By treating the photoresist with the solution containing a non-volatile component after developing but before drying, the non-volatile component fills the space between adjacent resist patterns and remains on the substrate during drying. The non-volatile component provides structural and mechanical support for the resist to prevent deformation or collapse by liquid surface tension forces.
申请公布号 US2005224923(A1) 申请公布日期 2005.10.13
申请号 US20040819936 申请日期 2004.04.08
申请人 发明人 DALEY JON;HISHIRO YOSHIKI
分类号 G03F7/40;H01L23/58;(IPC1-7):H01L23/58 主分类号 G03F7/40
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