| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring substrate that is unlikely to generate deterioration in strength, caused by interfacial delaminations with solder, while adopting a nickel plated layer containing P for a metal terminal pad. <P>SOLUTION: In the wiring substrate 1, the metal terminal pad 17 has a non-electrolyzed nickel plated layer 53 containing the P, whose content is ≥8.5 wt. % and ≤15 wt. %, and the non-electrolyzed nickel plated layer 53 is covered with a gold-base plated layer 54. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
