发明名称 INTEGRATED CIRCUIT DEVICE, MANUFACTURING METHOD THEREFOR, AND FORMING METHOD FOR VANADIUM OXIDE FILM
摘要 PROBLEM TO BE SOLVED: To provide a integrated circuit device having a vanadium oxide film that has no damage as a resistance body used for a temperature sensor, a manufacturing method for an integrated circuit device that can be formed without damaging the resistance body made up of vanadium oxide, and a forming method for a vanadium oxide film. SOLUTION: A vanadium oxide film is formed on an interlayer insulation film 4, and a silicon oxide film and a silicon nitride film are formed on its top in this order. Then, using a resist pattern as a mask, the silicon nitride film is patterned . After that, the resist pattern is removed by using a resist stripper or oxygen plasma ashing. Next, using the patterned silicon nitride film 14 as a mask, the silicon oxide film and vanadium oxide film are etched to form a resistor film 9 made of vanadium oxide. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005286239(A) 申请公布日期 2005.10.13
申请号 JP20040101108 申请日期 2004.03.30
申请人 NEC ELECTRONICS CORP;NEC CORP 发明人 KAWAHARA HISAYOSHI;MURASE HIROSHI;OKUBO HIROAKI;NAKASHIBA YASUTAKA;ODA NAOKI;SASAKI NARIHITO;ITO NOBUKAZU
分类号 H01L21/3065;H01L21/02;H01L21/316;H01L21/3213;H01L21/822;H01L21/8234;H01L23/522;H01L27/04;H01L37/00;H01L47/00;(IPC1-7):H01L21/822;H01L21/306 主分类号 H01L21/3065
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