| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition with which the problem that, as the water-proof low temperature curable water-based adhesive, mixtures of vinyl acetate resin emulsion with formaldehyde-based heat-curable resin such as urea resin or melamine resin, copolymers of crosslinkable monomers such as N-methylolacrylamide, and the like are conventionally used, these have water-resisting property, low temperature adhesiveness and the like but has problems such as containing plasticizers and releasing formaldehyde, is solved. SOLUTION: The adhesive composition is obtained by emulsion polymerization of vinyl acetate in the presence of acrylic resin containing carboxy-containing monomer by using polyvinyl alcohol and acetylated polyvinyl alcohol or acetoacetylated polyvinyl alcohol as the protective colloid. or by emulsion copolymerization of vinyl acetate monomer with a monomer having acetoacetyl group. COPYRIGHT: (C)2006,JPO&NCIPI
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