发明名称 |
Resin particle, conductive particle and anisotropic conductive adhesive containing the same |
摘要 |
Resin particles comprised of an acrylic resin. Not only is the maximum compression deformation ratio thereof as great as 60% or more but also the load required for 60% compression deformation is as small as 60 mN or less. Wiring boards are therefore coupled in using an anisotropic conductive adhesive obtained by first manufacturing conductive particles having a conductive coating formed on a resin particle surface of the resin particles by adhering a conductive material to the surface of the above resin particles as a core. On dispersing the conductive particles in an adhesive material, the conductive particles sandwiched between metallic wires of the wiring boards are greatly deformed by a small load, so that the electrical devices having a high conduction reliability can be obtained.
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申请公布号 |
US2005228144(A1) |
申请公布日期 |
2005.10.13 |
申请号 |
US20050517076 |
申请日期 |
2005.04.26 |
申请人 |
KAMIYA KAZUNOBU;KOJIMA RYOJI |
发明人 |
KAMIYA KAZUNOBU;KOJIMA RYOJI |
分类号 |
C08F2/00;C08J3/12;C09C3/10;C09J9/02;H01R4/04;H01R4/58;H05K3/32;(IPC1-7):B32B5/16;C08L67/00 |
主分类号 |
C08F2/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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