| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit device by which a wiring density is especially improved, and to provide its manufacturing method with regard to the circuit device including a passive element and its manufacturing method. <P>SOLUTION: The electrode 7 of the passive element 6 is plated with gold plating, and a bonding wire 8 is directly stuck to the electrode 7 by which a packaging density is improved. Moreover, an increase in thickness of a package is suppressed even in such constitution as the bonding wire 8 is stuck by bonding the passive element 6 to an isolation trench employing a package structure with no support substrate used. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
