| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor chip size package with its connection reliability improved. SOLUTION: The semiconductor chip size package comprises a semiconductor element, an insulating tape 2 on the semiconductor element, a metal wire 3 placed on the insulating tape 2 and provided with metal pads 5, and solder balls. A protrusion 6 having a cruciform section is formed, and it has side walls that decelerate the development of the cracks in case cracks occur in the interfaces between the solder balls and the metal pads 5, due to a stress exerted from outside, on the surfaces of the metal pads 5 in between the metal pads 5 electrically connecting the metal wire 3 laid on the insulating tape 2 and the solder balls. COPYRIGHT: (C)2006,JPO&NCIPI
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