| 摘要 |
PROBLEM TO BE SOLVED: To provide high reliable semiconductor laser device which can efficiently perform a heat dissipation of a plurality of semiconductor device, and to provide its manufacturing method. SOLUTION: In a purple-blue color semiconductor laser device 1, a p-electrode 12 is formed in upper surface, and an n-electrode 15 is formed in a lower surface; furthermore, a pn-junction surface 10, a junction surface between a p-type semiconductor and a n-type semiconductor, is formed. In a red color semiconductor laser device 2, an n-electrode 23 is formed in an upper surface, and a p-electrode 22 is formed in a lower surface; furthermore, a p-n junction surface 20, a junction surface between the p-type semiconductor and the n-type semiconductor, is formed. The p-electrode 22 of the red color semiconductor device 2 is joined on the p-electrode 12 through a solder film H so that it does not superimpose to a purple-blue color light-emitting point 11 of the purple-blue color semiconductor laser device 1. COPYRIGHT: (C)2006,JPO&NCIPI |
